Virtuelle Messe 16. – 18. Juni Virtual Trade Fair 16. – 18. June June 8th, 2020 | Walter A. Schaefer | News EN Besuchen Sie unseren virtuellen Messestand und lassen Sie sich aus erster Hand über unsere neuesten Verfahren informieren. Nehmen Sie Teil an unseren Präsentationen und sprechen Sie Live mit unseren Experten……………….. Visit our virtual exhibition stand and get first-hand information about our latest processes. Take part in our presentations and talk live with our experts.
Schlötter announces cooperation with Italtecno srl. June 3rd, 2020 | Walter A. Schaefer | News EN, Uncategorized In the future, Schlötter will cooperate with the Italian specialist Italtecno srl. in Modena in the field of surface treatment of aluminium and thus expand its competence in the field of surface treatment. Italtecno was founded in 1974 and specialises in the research and development of surface treatment technologies for aluminium and its alloys. In the early 1980s Italtecno expanded its market for chemical products, machinery and systems outside Europe and in many different sectors (aluminium for use in the building and construction, automotive and aerospace industries, and for decorative, mechanical and other industrial purposes) and in 1983 sold an important licence for special anodising technologies to Lockheed, thus making its debut on the American market. Italtecno then opened subsidiaries in Brazil, India and the Far East, as well as offices for agencies, sales and technical service in 25 different countries worldwide. With internationally recognized experts and researchers, Italtecno is one of the key partners for all users in the industry. Italtecno, based in northern Italy, works in close contact with customers to develop tailor-made technological solutions and provide post-sales technical support wherever an Italtecno customer is located in the world. This philosophy perfectly matches the product and service philosophy of Schlötter and forms the basis for a good future partnership. Schlötter will expand its portfolio of galvanic specialty chemicals by the anodising portfolio and the know-how of Italtecno and thus offer sales and service for processes for aluminium surface treatment in the future. Due to a very close cooperation also in the development area, tailor-made customer solutions for aluminium surface treatment can be offered in this way, as known from Schlötter’s electroplating area. At the virtual trade fair, which took place in June, attendees got a comprehensive picture of the new product portfolio on the special galvanic processes of Schlötter and the new processes for aluminium surface treatment of Italtecno. During this period, our sales teams from the fields of technology and electroplating chemistry, as well as the specialists from the Research & Development department, were on hand to discuss and explain the various processes. We welcome your questions and suggestions. Your Schlötter Team – Solutions for electroplating www.schloetter.de messe@schloetter.de
New processes April 10th, 2020 | Walter A. Schaefer | News EN One of our new processes is Pickle Degreaser SLOTOCLEAN BEF 1790. This pickle degreaser boasts a particularly high inhibition of iron with significantly reduced diffusion of hydrogen in the base materials to be pickled. This minimises the risk of hydrogen embrittlement and significantly increases the service life of the process. All processes Zinc-Nickel SLOTOLOY ZN 210 VX Barrel electrolyte SLOTOLOY ZN 210 VX was developed for the deposition of zinc-nickel alloy coatings (12-15 % nickel) and awarded the Innovation Prize of Baden-Württember in 2018. Particularly noteworthy are the consistently high current efficiency and high deposition rates in combination with a significant reduction of degradation products, which makes regular dilution of the electrolyte dispensable. The required bath voltage for SLOTOLOY ZN 210 VX is lower than for bright nickel-plated steel anodes and significantly lower than for comparable membrane processes. As a result, less current is needed for depositing the zinc-nickel alloy and less energy input for cooling, leading to a favourable CO2 balance. All processes Copper SLOTOCOUP SF 1960 The ever-increasing miniaturszation in PCB technology leads, among other things, to an increasing number of blind vias. These blind vias need must to be filled with copper without depositing too thick copper layers on the PCB surface. Copper SLOTOCOUP SF 1960 has shown a good performance in practial use and has been adopted by major PCB manufacturers. We are particularly proud of our inhouse development of the leveller in our organic laboratory, which is now being manufactured on a large scale in our subsidiary in Ireland. In doing this, we have the complete raw materials supply chain in our own hands. All processes Copper SLOTOCOUP BCH 2160 A customer request for a high-performance copper bath for use in horizontal continuous plating lines led to the development of Copper SLOTOCOUP BCH 2160, which is operated with only two fully analysable additives that can be fully analyzed. Depending on transport and electrolyte agitation, cathodic current densities up to 40 A/dm2 can be achieved. All processes Direct Metallisation SLOTOSIT PCB 3500 Highly effective, nanographite-based SLOTOSIT PCB 3500 is ideally suited for the direct metallisation of printed circuit boards, both FR4 and polyetherimide substrates. The process is easy to handle and boasts a very good deposition of the dielectric. Various copper electrolytes suitable for different applications are available for subsequent copper plating. All processes Indium SLOTOSON MI 1930 The metal indium is more and more used in electronics. Indium is soft and easily solderable. Indium SLOTOSON MI 1930 can be used for both rack and barrel applications and continuous plating lines. Indium is particularly suitable for the coating of press-fits, as indium is cold welded at room temperature, resulting in very good electrical connections. Zum Verfahrensbereich
Pickle Degreaser SLOTOCLEAN BEF 1790 March 30th, 2020 | Walter A. Schaefer | Neuentwicklungen Pickle Degreaser SLOTOCLEAN BEF 1790 features a particularly high inhibition of iron with significantly reduced diffusion of hydrogen in the base materials to be pickled. This minimises the risk of hydrogen embrittlement and significantly increases the service life of the process. Key facts (PDF) All processes
IndiumSLOTOSON MI 1930 March 30th, 2020 | Walter A. Schaefer | Neuentwicklungen The metal indium is more and more used in electronics. Indium is soft and easily solderable. Indium SLOTOSON MI 1930 can be used for both rack and barrel application annd continuous plating lines. Indium is particularly suitable for the coating of press-fits, as indium is cold welded at room temperature, resulting in very good electrical connections. Key facts(PDF) All processes
Direct MetallisationSLOTOSIT PCB 3500 March 30th, 2020 | Walter A. Schaefer | Neuentwicklungen Highly effective, nanographite-based SLOTOSIT PCB 3500 is ideally suited for the direct metallisation of printed circuit boards, both FR4 and polyetherimide substrates. The process is easy to handle and boasts a very good deposition of the dielectric. Various copper electrolytes suitable for different applications are available for subsequent copper plating. Key facts(PDF)
Zinc-Nickel SLOTOLOY ZN 210 VX March 30th, 2020 | Walter A. Schaefer | Neuentwicklungen Schlötter’s SLOTOLOY ZN VX technology was awarded the Innovation Prize of the state of Baden-Württemberg in 2018. Zinc-Nickel SLOTOLOY ZN 210 VX was developed for barrel applications and deposits zinc-nickel coatings (12-15% nickel).Particularly noteworthy are the consistently high current efficiency and the high deposition rate. Degradation products have been significantly reduced, which means that regular dilution of the electrolyte is not necessary. The required bath voltage for SLOTOLOY ZN 210 VX is lower than for bright nickel-plated steel anodes and significantly lower than for comparable membrane processes. This results not only in lower current quantities for depositing the zinc-nickel alloy, but also in lower energy consumption for cooling and, as a result, a favourable CO2 balance. Key facts(PDF) All processes
Copper SLOTOCOUP BCH 2160 March 30th, 2020 | Walter A. Schaefer | Neuentwicklungen A customer request for a high-performance copper bath for use in horizontal continuous plating lines led to the development of Copper SLOTOCOUP BCH 2160, which is operated with only two fully analysable additives that can be fully analyzed. Depending on transport and electrolyte agitation, cathodic current densities up to 40 A/dm2 can be achieved. Key facts (PDF) All processes
Copper SLOTOCOUP SF 1960 March 30th, 2020 | Walter A. Schaefer | Neuentwicklungen The ever-increasing miniaturisation in PCB technology leads, among other things, to an increasing number of blind vias. These blind vias need must to be filled with copper without depositing too thick copper layers on the PCB surface. Copper SLOTOCOUP SF 1960 has shown a good performance in practial use and has been adopted by major PCB manufacturers. We are particularly proud of our inhouse development of the leveller in our organic laboratory, which is now being manufactured on a large scale in our subsidiary in Ireland. In doing this, we have the complete raw materials supply chain in our own hands. SLOTOCOUP SF 1960 (PDF) All processes
Schlötter opens new subsidiary in Dongguan, China January 8th, 2020 | Walter A. Schaefer | News EN With the establishment of Schlötter (Dongguan) Surface Technology, located in the province of Guangdong, Schlötter is now also represented in the South of China in addition to Wuxi. Thus, Schlötter is moving closer to their customers. The Pearl River Delta Metropolitan Region in the South of China is one of the most dynamic regions in China: many PCB manufacturers are based in this area. Schlötter’s new Dongguang office currently has seven employees, offering technical support to customers using Schlötter electrolytes. The focus of the Dongguan team lies in the sale and service of applications in the PCB and electronics industry. The Schlötter (Dongguan) team also participated in HKPCA 2019, which was held in Shenzen from 04 – 06 December 2019. Matthias Hampel, PCB Technology Manager Asia of Schlötter and responsible for the Dongguan office, was highly satisfied with the attendance at the show: “Our booth was always highly frequented. Due to 5G, the latest trend on this year’s HKPCA was definitely pulse plating”. Address: Schlötter (Dongguan) Surface Technology Room 1001, Unit 4, Building 3 No. 200 Hongfu Rd., Nancheng Street Dongguan, PRC T +86 13771493309
