01803 Micro Etch SLOTETCH 584

Micro ETCH SLOTETCH 584 has been specifically designed for the pretreatment of printes circuit boards (PCB), integrated lead frames (IC Frames), copper and alloy 42 (Ni/Fe) material. Micro Etch 584 is equally suited for use in throughhole plating and all stages of pattern plating in the PCB manufacturing.

01070 Pickle Degreaser SLOTOCLEAN BEF 1790

SLOTOCLEAN BEF 1790 removes undesirable surface layers as well as contamination like rust, scale and oxide layers. Especially suitable for high-tensile steel. Very high inhibition value. SLOTOCLEAN BEF 1790 reduces the drag-out of hydrogen peroxide into the base material. Very low pickling attack, low hydrogen embrittlement.

01060 SLOTETCH20

Weak acidic, fluoride-free activation for Cu alloys which contain small quantities of silicon and Ni.

01043 SLOTETCH30

Copper activation acidic and free from complexing agents applied for the removal of Cu oxide layers in the PCB technology.