In electroless nickel plating, the layer is deposited onto the component without current. Electroless nickel is particularly suitable for components with complex geometries since this process allows the use of contour-accurate and uniform layers. Phosphorous deposition rates in the range of 6 – 12% result in layers with different properties. Schlötter offers a wide range of high-phos, medium-phos and low-phos processes (NiP).
Printed circuit board manufacturing (PCB), electronics, corrosion protection (CRC), mechanical engineering
Allround process with combined additive system for depositions with a P-content of 6 - 9 % at a high deposition rate of app. 18 - 20 µm.
Ionogenic activator for activating non-conductors for subsequent metal deposition. The activator contains palladium.
Deposition of nickel-phosphorus layers a with phosphorus content of 10.5 - 11.5 %. Especially high corrosion resistance.
Deposition of Ni-P layers with a P-content of 10 - 12 % in the coatings. Especially high corrosion resistance. Ammonium-free variant.
Deposition of Ni-B layers. Thin layers for metallizing of non-conducting material (plastic, ceramic).
Electrolyt for the deposition of Ni-P coatings on metals and non conductive materials with a P-content of 7 - 10 %.
Electrolyte for the deposition of Ni-P coatings on metals and none conductive materials with a P-content of.
Deposition of Ni-P layers with 7 - 10 % P; allround process; 4 - 5 MTO.
Deposition of Ni-P layers with a P-content of 9 - 10 %.
Deposition of Ni-P layers. Thin layers for metallizing of non-conducting material (plastic, ceramic).
Wetting agent for the use in electroless Ni processes to avoid pores.
Post-treatment for electroless Ni layers on Pd basis to improve the solderability
Allows soldering of electroless nickel deposits and is especially recommended for Electroless Nickel SLOTONIP 90.
Electrolyte for electroless pre-nickel plating of aluminium after zincate.
Chemical phosphorous-nickel electrolyte for the deposition of lieght, semi-bright to bright layers. Suitable for the coating of metals and non-conductors.
Electrolyte for the deposition of Ni-P layers with a P-content of 6 - 9 % of at a low temperature (80 °C).