Tin alloys

Due to their low melting point, tin-lead alloys were for many years the standard for solderable surfaces in the PCB and electronics industry. With the EU directive 2011/65/EU(RoHS) the use of tin-lead in electrical and electronic equipment was restricted. As an alternative to tin-lead, Schlötter developed silver (Ag), copper (Cu) and bismuth (Bi) alloys, which are available for barrel, rack and reel-to-reel applications.

Tin alloys are used

for the manufacturing of PCBs and electronics components (barrel and reel-to-reel applications).

Ddescription

Product / application

11000 Tin-Lead LA

Borofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with approx. 60 % tin in the alloy.

11003 Lead-Tin-Copper SLOTOLET CSP 10 1

Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites.

11004 Tin-Lead SLOTOLET KB 10

Acidic and low-foaming tin-lead bath for continuous plating lines.

11013 Tin-Lead SLOTOLET KB 30

Process for subsequent plating of IC packages (trim and form process).

11022 Tin-Copper SLOTOLOY SNC 20

Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 - 10 % Cu. The tendency to form whiskers is reduced.

11025 Tin-Silver SLOTOLOY SNA 30

Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approx. 3% silver co-deposition in the alloy. Suitable for rack, barrel and reel-to-reel applications.

11042 Tin-Lead SLOTOLET KB

Process for rack- and reel-to-reel plating lines. 5 - 90 % lead.

11048 Bright Tin-Lead SLOTOLET GB 20

Deposits low-carbon layers with 5 - 10 % lead in continuous plating lines.

11053 Tin-Lead SLOTOLET GB 60

Fluoride- and formalin-free electrolyte for the deposition of bright tin-lead coatings, primarily for alloys containing 5 - 40 % lead. Mainly used in reel-to-reel installations.

11072 Lead MSN 10 1

Multi-purpose, strong acidic and fluoride-free electrolyte for the deposition of smooth and dendrite-free coatings, even when thick layers of 200 µm or more are deposited.

11201 Tin-Lead SLOTOLET K 10 1

Strong acidic fluoride-free electrolyte for the deposition of matt layers with 5-10% lead in the alloy. The alloy is stable over a wide current density range.

11222 Bright Tin-Lead SLOTOLET G 20 1

Fluoride- and formaldehyde-free electrolyte, based on organic acid, for the deposition of bright tin-lead coatings, for alloys containing 5 - 10 % lead.

11223 Bright Tin-Lead SLOTOLET G 30 1

Fluoride- and formaldehyde-free electrolyte for the deposition of bright tin-lead coatings, for alloys containing up to 40 % lead.

11224 Bright Tin-Lead SLOTOLET G 40 1

Fluoride and formaldehyde free process for the deposition of superbright tin-lead coatings with up to 40 % lead in the alloy.

11225 Tin-Lead SLOTOLET G 50 1

Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright tin lead coatings. Haze-free bright coatings are easily achieved with 5 - 35 % lead in the alloy.

11304 Tin-Bismuth SLOTOLOY SNB 30 1

The strongly acidic tin-bismuth alloy electrolyte is for the deposition of silky matt Sn-Bi alloys with an bismuth co-deposition rate of up to 5 %.

11401 Tin-Nickel SLOTOLOY NIT 10

Deposits brightness-retaining alloy coatings composed of approx. 65% tin and 35% nickel. Can be run on a wide current density range, approx. 0.1 - 5.0 A/dm². Suitable for for rack and barrel plating.

13188 Bismuth SLOTOSON MB 1880

13193 Indium SLOTOSON MI 1930