Due to their low melting point, tin-lead alloys were for many years the standard for solderable surfaces in the PCB and electronics industry. With the EU directive 2011/65/EU(RoHS) the use of tin-lead in electrical and electronic equipment was restricted. As an alternative to tin-lead, Schlötter developed silver (Ag), copper (Cu) and bismuth (Bi) alloys, which are available for barrel, rack and reel-to-reel applications.
for the manufacturing of PCBs and electronics components (barrel and reel-to-reel applications).
Borofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with approx. 60 % tin in the alloy.
Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites.
Acidic and low-foaming tin-lead bath for continuous plating lines.
Process for subsequent plating of IC packages (trim and form process).
Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 - 10 % Cu. The tendency to form whiskers is reduced.
Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approx. 3% silver co-deposition in the alloy. Suitable for rack, barrel and reel-to-reel applications.
Process for rack- and reel-to-reel plating lines. 5 - 90 % lead.
Deposits low-carbon layers with 5 - 10 % lead in continuous plating lines.
Fluoride- and formalin-free electrolyte for the deposition of bright tin-lead coatings, primarily for alloys containing 5 - 40 % lead. Mainly used in reel-to-reel installations.
Multi-purpose, strong acidic and fluoride-free electrolyte for the deposition of smooth and dendrite-free coatings, even when thick layers of 200 µm or more are deposited.
Strong acidic fluoride-free electrolyte for the deposition of matt layers with 5-10% lead in the alloy. The alloy is stable over a wide current density range.
Fluoride- and formaldehyde-free electrolyte, based on organic acid, for the deposition of bright tin-lead coatings, for alloys containing 5 - 10 % lead.
Fluoride- and formaldehyde-free electrolyte for the deposition of bright tin-lead coatings, for alloys containing up to 40 % lead.
Fluoride and formaldehyde free process for the deposition of superbright tin-lead coatings with up to 40 % lead in the alloy.
Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright tin lead coatings. Haze-free bright coatings are easily achieved with 5 - 35 % lead in the alloy.
The strongly acidic tin-bismuth alloy electrolyte is for the deposition of silky matt Sn-Bi alloys with an bismuth co-deposition rate of up to 5 %.
Deposits brightness-retaining alloy coatings composed of approx. 65% tin and 35% nickel. Can be run on a wide current density range, approx. 0.1 - 5.0 A/dm². Suitable for for rack and barrel plating.