Schlötter has always been to the forefront in the development of copper plating solutions which have been modified over the years to cater for the ever increasing demands which have come particularly from the PCB and electronics industries. Due to the unique characteristics which include good electrical and thermal conductivity, excellent throwing power, low hardness and bright ductile deposits copper is used universally in electroplating technology. Copper coatings are also used as intermediate layers to improve corrosion resistance and adhesion before nickel, silver, tin and chrome plating. Schlötter’s portfolio includes bright copper systems for plastic and decorative applications as well as BV and TH filling and superfilling processes for the PCB and electronics industry.
plating of plastics(POP), decorative coatings (GMF), PCB manufacturing, electronics and electroforming
Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation.
Acid electrolyte with a high degree of brightness and levelling. The deposition rate is very high.
Cyanide based high-performance electrolyte for the deposition of bright, smooth, fine crystalline and ductile copper layers.
Highly economical and easy to oprate electrolyte for the deposition of decorative copper coatings.
Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power.
PCB electrolyte for the deposition of bright, levelling layers with low internal stress at excellent metal distribution.
Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings. Cathodic current density up to 10 A/dm2.
Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating).
For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface.
SuperFilling copper electrolyte for the application in vertical plants, especially for the filling of Blind Microvias and even lower layer thickness on the suface of the PCB than SLOTOCOUP SF 30.
Very economical and easy to operate electrolyte for the deposition of decorative copper coatings.
Copper SLOTOCOUP 1960 is used for the production of multilayer printed circuit boards in the field of automotive, computer and smartphone. Complete filling of blind microvias and copper plating of through holes in one process step.
For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process.
Copper SLOTOCOUP TF 1350 has especially been developed for the filling of through holes with an aspect ratio > 2.5 by Reverse Pulse Plating.
Elektrolyte operated with DC, enables very good throwing power in high aspect ratio holes.
Copper SLOTOCOUP CU 1450 is used for the production of printed circuit boards for automotive and base station applications. The electrolyte is operated with direct current and enables very good throwing power in high aspect ratio holes
Copper electrolyte, cyanide containing alkaline solution for the deposition of bright, smooth fine crystalline and ductile copper deposits. The electrolyt features an excellent throwing power in the low current density areas.
Copper SLOTOCOUP SF 40 is used for the production of HDI printed circuit boards in order to achieve superfilling of blind microvias in one process step and copper plating of through holes at the same time especially for mSAP applications.
In combination with RRP SLOTOCOUP PRT 2200 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP PRT 2200 can also be operated with direct current (DC).
Application in vertical plating lines. One-step process for filling blind microvias, pattern plating and through-hole metallisation.
Electrolyte developed for copper plating of PCBs if processes of direct plating are applied. Can also be used as RRP electrolyte.
This electrolyte uses the the advantages of Reverse Pulse Plating (RPP) in connection with vertical reel-to-reel plating plants optimally.
Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias.
In combination with RRP SLOTOCOUP CU 210 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC).
