The processes of the SLOTOSIT series include processes for metallisation of plastics and non-conductors. With SLOTOSIT KM, Schlötter has developed a process for the adhesive metallisation of special plastics (PA, IXEF, PEEK, etc.) which are conditioned in gaseous SO3. With SLOTOSIT PCB, Schlötter offers a graphite-based process for through-hole plating of printed circuit boards.

Processes of the SLOTOSIT KM and SLOTOSIT PCB series are used:

for the metallisation of plastics and through-hole plating and metallisation of PCBs.