Tin has been used in electroplating for many decades and Schlötter has always been to the fore in tin plating chemistry. Tin plating is the process of depositing a coating of solderable tin plating onto the surface of a material via an electrical current. Electroplating tin is an extremely cost-effective process. This is due to tin being so readily available and much less expensive than metals such as gold, platinum or palladium. Today, it is hard to imagine the printed circuit board and electronics industry without tin being used for solderable layers. Tin can be deposited in both matt with a defined grain size and bright layers. Tin is food safe and is therefore used in the food industry (e.g. cans).
for tin-plating of household goods, packaging of food products, decorative coatings (GMF), PCB manufacturing and electronics
Acidic fluoride-free electrolyte for the deposition of silky-matt fine crystalline coatings. It's used in reel-to-reel plating lines for the tinning of wires or strips.
Acidic, fluoride-free electrolyte for the depositin of satin-matt and fine-crystalline coatings. Used for tin plating of wires and tapes in reel-to-reel installations.
Sulphur-acid electrolyte, weakly foaming especially for barrel and continuous plating lines.
Strongly acidic, flouride-free process for the deposition of silky-matt fine crystalline coatings in continuous plating lines, with only little tendency towards formation of tin-whiskers.
Matt tin electrolyte with excellent coverage and solderability.
Fluoride-free, acidic electrolyte for the deposition of bright tin coatings in reel-to-reel installations. Excellent solderability even after prolonged storage or heat ageing.
Weak acid, flouride-free electrolyte for the deposition of matt coatings. Matt Tin SLOTOTIN 60 is used for plating of electronic componentsy with glass or ceramic parts.
Fluoride-free, acidic electrolyte for the deposition of bright tin coatings in reel-to-reel installations. Depending on plant design and operating temperature high current densities can be achieved. Foaming of the additives is very low, even during intensive electrolyte agitation.
Sulphuric acid based electrolyte for the deposition of very bright tin coatings in rack or barrel applications. Low bath temperatures, reduced cloudiness, moderate foaming.
Electrolyt on the basis of sulphuric acid for the deposition of silk-matt tin coatings on electronical or electrotechncal components.
Removes tin(IV) from acid tin electrolytes.
Electroless deposition of tin on copper and copper alloys. Brightening of lead or tin-lead surfaces.
Immersion Tin AL 10 is a process for the electroless deposition of tin on aluminium and its alloys (eg. aluminium pistons) in charge exchange.
Universally applicable, strong acidic, fluoride-free electrolyte for rack-, barrel-, and PCB applications. It deposits matt to silky matt, fine crystalline coatings.
Sulphuric acid based electrolyte for the deposition of very bright tin coatings in rack and barrel applications. Low bath temperatures and reduced cloudiness.
Sulphate-free electrolyte giving a fine crystalline deposit with excellent covering power. Compatible with lead-free solders. Tendency to whisker formation is reduced.
Superbright tin layers at any thickness for rack and barrel application. Printed circuit boards, electro-technical components, household appliances.
Sulphuric acid based electrolyte for the deposition of bright pure tin layers in rack or barrel applications. Special brightener is available for pcb manufacturing.
Sulphate-free electrolyte giving a fine-crystalline deposit with good covering power. It shows good tolerance to bleeding of alkaline resists.
Sulphuric acid based electrolyte giving fine crystalline deposits with excellent covering power and solderability.
Strongly acidic tin electrolyte for the deposition of semi-bright coatings even in the low current density range.Suitable for geometrically complex components. The grain size is between 0.8 and 2.0 µm. Plated layers are compatible with all lead-free solder alloys.
Tin SLOTOTIN BTH 1740 is for the use in reel-to-reel installations. The fluoride free acidic electrolyte deposits bright tin coatings. Solderability is still excellent even after tempering.
Organic-based fluoride- and formaldehyde-free process for the deposition of bright tin coatings. Solderability of the tin coatings is excellent, even after accelerated heat ageing. The deposits are not sensitive towards fingerprints.
Semi-bright Tin GF 50 is an organic acid-based fluoride- and formaldehyde-free process for the deposition of semi-bright tin coatings. Solderability of the tin coatings is excellent, even after accelerated heat ageing at eg. 155℃/16 hours. The coatings are insensitive to fingerprints.
