Kupfer / Leiterplatten

Copper electrolytes for the manufacturing of printed circuit boards of the latest generation (mobile phone standard 5G) are one of our strengths. Current highlights include processes that are able to fill blind microvias (blind holes) and to metallise through holes with good metal distribution even under unfavorable geometric conditions. Our product range includes processes for direct current as well as pulse plating processes

PCB copper processes are used

in the production of printed circuit boards and electronic components for further miniaturisation and increased integration density.

Ddescription

Product / application

03007 Bright Copper SLOTOCOUP CU 40

Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation.

03019 Copper Bath SLOTOCOUP CU 50

Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power.

03023 Bright Copper SLOTOCOUP CU 20

PCB electrolyte for the deposition of bright, levelling layers with low internal stress at excellent metal distribution.

03025 Copper SLOTOCOUP CU 80

Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings.  Cathodic current density up to 10 A/dm2.

03026 Copper Bath SLOTOCOUP HL 10

Application in horizontal continuous plating lines.  Especially suitable for periodic reverse current (reverse pulse plating).

03032 Copper SLOTOCOUP SF 20

For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface.

03033 Copper SLOTOCOUP SF 30

SuperFilling copper electrolyte for the application in vertical plants, especially for the filling of Blind Microvias and even lower layer thickness on the suface of the PCB than SLOTOCOUP SF 30.

03059 Copper SLOTOCOUP PRT 1900

Electrolyte developed for copper plating of PCBs if processes of direct plating are applied. Can also be used as RRP electrolyte.

03105 Copper SLOTOCOUP BV 50

For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process.

03135 Copper SLOTOCOUP TF 1350

03145 Copper SLOTOCOUP CU 1370

Elektrolyte operated with DC, enables very good throwing power in high aspect ratio holes.

03150 Copper SLOTOCOUP CU 1450

03172 Copper SLOTOCOUP CN 1720

03180 Copper SLOTOCOUP CF 1800

03196 Copper SLOTOCOUP SF 40

03220 Copper SLOTOCOUP PRT 2200

In combination with RRP SLOTOCOUP PRT 2200 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP PRT 2200 can also be operated with direct current (DC).

03311 Bright Copper SLOTOCOUP BV 110

Application in vertical plating lines.  One-step process for filling blind microvias, pattern plating and through-hole metallisation.

03810 Copper SLOTOCOUP PRT 120 D

Electrolyte developed for copper plating of PCBs if processes of direct plating are applied. Can also be used as RRP electrolyte.

03812 Copper SLOTOCOUP PRT 120

This electrolyte uses the the advantages of Reverse Pulse Plating (RPP) in connection with vertical reel-to-reel plating plants optimally.

03814 Copper SLOTOCOUP CU 140

Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias.

03820 Copper SLOTOCOUP PRT 2020

In combination with RRP SLOTOCOUP PRT 2020 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP PRT 2020 can also be operated with direct current (DC).

03821 Copper SLOTOCOUP CU 210

In combination with RRP SLOTOCOUP CU 210 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC).