Copper electrolytes for the manufacturing of printed circuit boards of the latest generation (mobile phone standard 5G) are one of our strengths. Current highlights include processes that are able to fill blind microvias (blind holes) and to metallise through holes with good metal distribution even under unfavorable geometric conditions. Our product range includes processes for direct current as well as pulse plating processes
in the production of printed circuit boards and electronic components for further miniaturisation and increased integration density.
Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation.
Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power.
PCB electrolyte for the deposition of bright, levelling layers with low internal stress at excellent metal distribution.
Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings. Cathodic current density up to 10 A/dm2.
Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating).
For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface.
SuperFilling copper electrolyte for the application in vertical plants, especially for the filling of Blind Microvias and even lower layer thickness on the suface of the PCB than SLOTOCOUP SF 30.
Electrolyte developed for copper plating of PCBs if processes of direct plating are applied. Can also be used as RRP electrolyte.
For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process.
Elektrolyte operated with DC, enables very good throwing power in high aspect ratio holes.
In combination with RRP SLOTOCOUP PRT 2200 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP PRT 2200 can also be operated with direct current (DC).
Application in vertical plating lines. One-step process for filling blind microvias, pattern plating and through-hole metallisation.
This electrolyte uses the the advantages of Reverse Pulse Plating (RPP) in connection with vertical reel-to-reel plating plants optimally.
Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias.
In combination with RRP SLOTOCOUP PRT 2020 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP PRT 2020 can also be operated with direct current (DC).
In combination with RRP SLOTOCOUP CU 210 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC).