11048 Bright Tin-Lead SLOTOLET GB 20 August 27th, 2019 | Julia Krämer | Deposits low-carbon layers with 5 – 10 % lead in continuous plating lines.
11042 Tin-Lead SLOTOLET KB August 27th, 2019 | Julia Krämer | Process for rack- and reel-to-reel plating lines. 5 – 90 % lead.
11025 Tin-Silver SLOTOLOY SNA 30 August 27th, 2019 | Julia Krämer | Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approx. 3% silver co-deposition in the alloy. Suitable for rack, barrel and reel-to-reel applications.
11022 Tin-Copper SLOTOLOY SNC 20 August 27th, 2019 | Julia Krämer | Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 – 10 % Cu. The tendency to form whiskers is reduced.
11013 Tin-Lead SLOTOLET KB 30 August 27th, 2019 | Julia Krämer | Process for subsequent plating of IC packages (trim and form process).
11004 Tin-Lead SLOTOLET KB 10 August 27th, 2019 | Julia Krämer | Acidic and low-foaming tin-lead bath for continuous plating lines.
11003 Lead-Tin-Copper SLOTOLET CSP 10 1 August 27th, 2019 | Julia Krämer | Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites.
11000 Tin-Lead LA August 27th, 2019 | Julia Krämer | Borofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with approx. 60 % tin in the alloy.
