03821 Copper SLOTOCOUP CU 210 August 27th, 2019 | Julia Krämer | In combination with RRP SLOTOCOUP CU 210 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC).
03814 Copper SLOTOCOUP CU 140 August 27th, 2019 | Julia Krämer | Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias.
03812 Copper SLOTOCOUP PRT 120 August 27th, 2019 | Julia Krämer | This electrolyte uses the the advantages of Reverse Pulse Plating (RPP) in connection with vertical reel-to-reel plating plants optimally.
03150 Copper SLOTOCOUP CU 1450 August 27th, 2019 | Julia Krämer | Copper SLOTOCOUP CU 1450 is used for the production of printed circuit boards for automotive and base station applications. The electrolyte is operated with direct current and enables very good throwing power in high aspect ratio holes
03135 Copper SLOTOCOUP TF 1350 August 27th, 2019 | Julia Krämer | Copper SLOTOCOUP TF 1350 has especially been developed for the filling of through holes with an aspect ratio > 2.5 by Reverse Pulse Plating.
03105 Copper SLOTOCOUP BV 50 August 27th, 2019 | Julia Krämer | For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process.
03096 Copper SLOTOCOUP SF 1960 August 27th, 2019 | Julia Krämer | Copper SLOTOCOUP 1960 is used for the production of multilayer printed circuit boards in the field of automotive, computer and smartphone. Complete filling of blind microvias and copper plating of through holes in one process step.
03026 Copper Bath SLOTOCOUP HL 10 August 27th, 2019 | Julia Krämer | Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating).
03019 Copper Bath SLOTOCOUP CU 50 August 27th, 2019 | Julia Krämer | Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power.
03007 Bright Copper SLOTOCOUP CU 40 August 27th, 2019 | Julia Krämer | Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation.
