03821 Copper SLOTOCOUP CU 210

In combination with RRP SLOTOCOUP CU 210 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC).

03220 Copper SLOTOCOUP PRT 2200

In combination with RRP SLOTOCOUP PRT 2200 enables with RPP a excellent metal distribution in through holes. SLOTOCOUP PRT 2200 can also be operated with direct current (DC).

03196 Copper SLOTOCOUP SF 40

Copper SLOTOCOUP SF 40 is used for the production of HDI printed circuit boards in order to achieve superfilling of blind microvias in one process step and copper plating of through holes at the same time especially for mSAP applications.

03172 Copper SLOTOCOUP CN 1720

Copper electrolyte, cyanide containing alkaline solution for the deposition of bright, smooth fine crystalline and ductile copper deposits. The electrolyt features an excellent throwing power in the low current density areas.

03150 Copper SLOTOCOUP CU 1450

Copper SLOTOCOUP CU 1450 is used for the production of printed circuit boards for
automotive and base station applications. The electrolyte is operated with direct current and
enables very good throwing power in high aspect ratio holes