03135 Copper SLOTOCOUP TF 1350 August 27th, 2019 | Julia Krämer | Copper SLOTOCOUP TF 1350 has especially been developed for the filling of through holes with an aspect ratio > 2.5 by Reverse Pulse Plating.
03105 Copper SLOTOCOUP BV 50 August 27th, 2019 | Julia Krämer | For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process.
03096 Copper SLOTOCOUP SF 1960 August 27th, 2019 | Julia Krämer | Copper SLOTOCOUP 1960 is used for the production of multilayer printed circuit boards in the field of automotive, computer and smartphone. Complete filling of blind microvias and copper plating of through holes in one process step.
03065 Bright Copper SLOTOCOUP TB 50 August 27th, 2019 | Julia Krämer | Very economical and easy to operate electrolyte for the deposition of decorative copper coatings.
03033 Copper SLOTOCOUP SF 30 August 27th, 2019 | Julia Krämer | SuperFilling copper electrolyte for the application in vertical plants, especially for the filling of Blind Microvias and even lower layer thickness on the suface of the PCB than SLOTOCOUP SF 30.
03032 Copper SLOTOCOUP SF 20 August 27th, 2019 | Julia Krämer | For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface.
03026 Copper Bath SLOTOCOUP HL 10 August 27th, 2019 | Julia Krämer | Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating).
03025 Copper SLOTOCOUP CU 80 August 27th, 2019 | Julia Krämer | Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings. Cathodic current density up to 10 A/dm2.
03023 Bright Copper SLOTOCOUP CU 20 August 27th, 2019 | Julia Krämer | PCB electrolyte for the deposition of bright, levelling layers with low internal stress at excellent metal distribution.
03019 Copper Bath SLOTOCOUP CU 50 August 27th, 2019 | Julia Krämer | Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power.
