Productronica 2023: Schlötter is Part of it November 9th, 2023 | Stefanie Geldbach Dr. | News EN From November 14-17, 2023, Schlötter will be represented at productronica in Munich, which takes place this year from November 14-17, 2023. As the world’s leading trade fair, productronica presents the full range of technologies and solutions for electronics manufacturing and provides insights into the latest trends. Every two years, the world of electronics manufacturing meets in Munich and exhibitors and visitors from all over the world make productronica an important meeting place and source of inspiration for the industry. The cleaners SLOTOCLEAN S 20, SLOTOCLEAN 40 and SLOTOCLEAN S 80, which have an excellent cleaning and wetting effect and are an important basic requirement for filling blind vias. The micro etches SLOTOCLEAN S 40 and SLOTETCH 584, which combine deoxidation with a defined etch rate depending on the application. The SLOTOCOUP SF 50, SLOTOCOUP XF 60 and SLOTOCOUP SF 1960 copper baths, which are used with great success for filling and metallising structures with different geometries (conductor tracks, blind holes, through-holes). The SLOTOCOUP PRT 2200 and 3300 (pulse reverse) copper baths are used to achieve conformal coating of high aspect ratios. The SAT 20-1 tin baths and the new bisphenol-free SLOTOTIN MT 1460 tin bath have a high covering capacity and etch resistance even at low coating thicknesses. At the same time, the deposited tin coatings have a very low tendency to whisker formation due to their grain structure and low carbon content. as well as a physical test bench developed together with iChemAnalytics to investigate whisker formation and tribological properties of coatings. The test stand is a world first and the tests can be carried out at different temperatures and in the absence of oxygen. Schlötter also focuses on the CO2 footprint and explains the CO2 footprint of the products on offer and how CO2 emissions can be minimised when using Schlötter processes. The company has set itself the goal of becoming CO2-neutral by 2030 and would also like to support its customers and partners in this endeavour. We look forward to your visit in Hall B3, Stand N-221
Copper SLOTOCOUP SF 1960 March 30th, 2020 | Julia Krämer | Neuentwicklungen The ever-increasing miniaturisation in PCB technology leads, among other things, to an increasing number of blind vias. These blind vias need must to be filled with copper without depositing too thick copper layers on the PCB surface. Copper SLOTOCOUP SF 1960 has shown a good performance in practial use and has been adopted by major PCB manufacturers. We are particularly proud of our inhouse development of the leveller in our organic laboratory, which is now being manufactured on a large scale in our subsidiary in Ireland. In doing this, we have the complete raw materials supply chain in our own hands. SLOTOCOUP SF 1960 (PDF) All processes