The ever-increasing miniaturisation in PCB technology leads, among other things, to an increasing number of blind vias. These blind vias need must to be filled with copper without depositing too thick copper layers on the PCB surface. Copper SLOTOCOUP SF 1960 has shown a good performance in practial use and has been adopted by major PCB manufacturers. We are particularly proud of our inhouse development of the leveller in our organic laboratory, which is now being manufactured on a large scale in our subsidiary in Ireland. In doing this, we have the complete raw materials supply chain in our own hands.
SLOTOCOUP SF 1960 (PDF) All processes
