Pickle Degreaser SLOTOCLEAN BEF 1790 March 30th, 2020 | Julia Krämer | Neuentwicklungen Pickle Degreaser SLOTOCLEAN BEF 1790 features a particularly high inhibition of iron with significantly reduced diffusion of hydrogen in the base materials to be pickled. This minimises the risk of hydrogen embrittlement and significantly increases the service life of the process. Key facts (PDF) All processes
IndiumSLOTOSON MI 1930 March 30th, 2020 | Julia Krämer | Neuentwicklungen The metal indium is more and more used in electronics. Indium is soft and easily solderable. Indium SLOTOSON MI 1930 can be used for both rack and barrel application annd continuous plating lines. Indium is particularly suitable for the coating of press-fits, as indium is cold welded at room temperature, resulting in very good electrical connections. Key facts(PDF) All processes
Direct MetallisationSLOTOSIT PCB 3500 March 30th, 2020 | Julia Krämer | Neuentwicklungen Highly effective, nanographite-based SLOTOSIT PCB 3500 is ideally suited for the direct metallisation of printed circuit boards, both FR4 and polyetherimide substrates. The process is easy to handle and boasts a very good deposition of the dielectric. Various copper electrolytes suitable for different applications are available for subsequent copper plating. Key facts(PDF)
Zinc-Nickel SLOTOLOY ZN 210 VX March 30th, 2020 | Julia Krämer | Neuentwicklungen Schlötter’s SLOTOLOY ZN VX technology was awarded the Innovation Prize of the state of Baden-Württemberg in 2018. Zinc-Nickel SLOTOLOY ZN 210 VX was developed for barrel applications and deposits zinc-nickel coatings (12-15% nickel).Particularly noteworthy are the consistently high current efficiency and the high deposition rate. Degradation products have been significantly reduced, which means that regular dilution of the electrolyte is not necessary. The required bath voltage for SLOTOLOY ZN 210 VX is lower than for bright nickel-plated steel anodes and significantly lower than for comparable membrane processes. This results not only in lower current quantities for depositing the zinc-nickel alloy, but also in lower energy consumption for cooling and, as a result, a favourable CO2 balance. Key facts(PDF) All processes
Copper SLOTOCOUP BCH 2160 March 30th, 2020 | Julia Krämer | Neuentwicklungen A customer request for a high-performance copper bath for use in horizontal continuous plating lines led to the development of Copper SLOTOCOUP BCH 2160, which is operated with only two fully analysable additives that can be fully analyzed. Depending on transport and electrolyte agitation, cathodic current densities up to 40 A/dm2 can be achieved. Key facts (PDF) All processes
Copper SLOTOCOUP SF 1960 March 30th, 2020 | Julia Krämer | Neuentwicklungen The ever-increasing miniaturisation in PCB technology leads, among other things, to an increasing number of blind vias. These blind vias need must to be filled with copper without depositing too thick copper layers on the PCB surface. Copper SLOTOCOUP SF 1960 has shown a good performance in practial use and has been adopted by major PCB manufacturers. We are particularly proud of our inhouse development of the leveller in our organic laboratory, which is now being manufactured on a large scale in our subsidiary in Ireland. In doing this, we have the complete raw materials supply chain in our own hands. SLOTOCOUP SF 1960 (PDF) All processes
